ANC technology reduces background noise for improved communication, enhancing safety and operational efficiency in high-noise environments, used in globally trusted intercommunications systems.
CIC develops high-performance, cost-effective analog ASICs that meet challenging specifications and are found in diverse markets including automotive and smart energy.
CIC provides mixed-signal custom ASICs solutions tailored for automotive, industrial, defense, and avionics applications, taking full responsibility from specification through production.
Custom Integrated Circuits integrates high-voltage power management features into PMICs to save space, reduce BOM costs, and improve efficiency, suitable for demanding applications in various industries.
HDI PCBs offer high-density attributes such as laser microvias and multiple layers of copper-filled stacked microvias, which provide necessary routing and signal integrity for today’s advanced technology products.
TTM's proven lineup of multi-layer Xinger® brand products offers various passive RF components for wireless infrastructure and consumer electronics applications.
Integrated microwave assemblies deliver sophisticated integrated electronics for numerous platforms, ranging from digital RF memory ("DRFM") to frequency up/down converters ("UDC") and channelized amplifiers that can withstand the rugged environments of military and space applications.
TTM has experience designing and manufacturing complex passive and active beamformers for space-based, multiple-beam communication array payloads. Our development of unique design technology and vertically-integrated manufacturing processes enables us to meet the exacting RF network performance requirements needed for accurate beam pointing and steering, with a proven track record of delivery for major constellations such as Globalstar, Iridium, and IridiumNEXT, as well as for secure GEO United States government communication payloads.
TTM’s development of unique beamformer design technology and vertically integrated manufacturing processes enable us to deliver high-performance RF assemblies critical to the mission requirements of modern passive and active phased-array radar applications. Whether the requirements call for a custom passive RF beamforming solution or a complex, highly-integrated active radar front-end architecture, TTM offers a long history of design and production of radar products qualified for land, sea, air, and space environments.
TTM is an industry leader in developing innovative beamformer technology for prime military and space contractors. We offer a wealth of expertise to deliver a variety of active and passive high-performance RF assemblies. This includes L-band/LEO and L- and S-band/GEO space beamformers, UHF thru Ka-band radar AESA RF networks, Butler matrices (multiple connector styles, cellular & PCS/DCS bands, high- and low-power), multi-octave, and more.
TTM Technologies offers low-temperature cofired ceramics (“LTCC”), thick-film, and standard resistive ceramic component manufacturing for numerous applications. Specializing in the fabrication of extremely tight-tolerance and high-reliability circuits, we bring deep engineering expertise and world-class infrastructure to your projects.
For cost-effective solutions that enable multi-layer, RF, and chip-on-flex requirements bound for aerospace, defense, space, medical, and telecommunications markets, TTM offers substrate-like solutions that meet the low-loss, high-speed needs for high-reliability applications.
Thermal management is essential to maintaining the component temperature within designed values by removing excess generated heat. This process ensures reliable products and extended product life, especially in applications requiring advanced thermal management due to high frequencies, increased data rates, and high component density.
TTM supports a wide range of frequency bands and provides complete lifecycle support with capabilities in engineered thermal solutions, low-loss laminate materials, and microwave attenuators, ensuring reliability and adherence to industry standards.
Rigid-Flex and Flex products provide reliable integration of multiple rigid printed circuit board assemblies into a single PCB module capable of supporting assembly, space/weight savings, and mechanical stability.
