Custom Integrated Circuits integrates high-voltage power management features into PMICs to save space, reduce BOM costs, and improve efficiency, suitable for demanding applications in various industries.
CIC develops high-performance, cost-effective analog ASICs that meet challenging specifications and are found in diverse markets including automotive and smart energy.
For cost-effective solutions that enable multi-layer, RF, and chip-on-flex requirements bound for aerospace, defense, space, medical, and telecommunications markets, TTM offers substrate-like solutions that meet the low-loss, high-speed needs for high-reliability applications.
Thermal management is essential to maintaining the component temperature within designed values by removing excess generated heat. This process ensures reliable products and extended product life, especially in applications requiring advanced thermal management due to high frequencies, increased data rates, and high component density.
HDI PCBs offer high-density attributes such as laser microvias and multiple layers of copper-filled stacked microvias, which provide necessary routing and signal integrity for today’s advanced technology products.
Safran Electrical Components designs and manufactures transitions, junctions, bulkhead fittings and joiners that provide EMC, EMI, lightning strike and physical protection for wiring systems for demanding environments. They fit with conduit systems and open sleeve systems.
